Copper Bonding Wire

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01/
Copper Bonding Wire

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02/
Copper Bonding Wire Data Sheet

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03/
CO 純銅線

Low Cost
Lower Electrical and Heat Resistance
Strong Tensile Strength

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04/
PCO 鍍鈀銅線

Stable Chemical Property
Easy to Form Spherical FAB
Strong Surface Adhesion

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Bond-ability and Work-ability Confirmation
Package type: BGA. Pad pitch: 62.7um
Pad open: 47*59. Al thickness: 0.8um
Wire Dia.: 0.8mil


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PCO Hardness of FAB / HAZ / Wire

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05/
PCA 
Strong Antioxidant Ability
Lower FAB Hardness
Lower Aluminum Layer Extrusion

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Au, Pd distribution in FAB/1st Bond

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Process Window Test

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