| Proform

Solder Preforms
Solder preforms are solder materials fabricated into various shapes according to customer specifications. Our company provides solder preforms in a wide range of sizes with high dimensional precision and excellent soldering performance, suitable for applications across multiple industrial sectors.

• Supply over one hundred alloy compositions, including Au80Sn20, Au88Ge12, and many others.
• Precise control of solder volume
• Excellent oxidation resistance and high reliability
• Reduced voiding rate
• Flexible customization with short lead time
• Simplified processing and uniform coating
• Accurate flux content control
• ROL0 no-clean flux
• Low residue, easy to clean
• Available in both room-temperature and refrigerated pre-coated products

Product Advantages

In-house R&D and Customized Solder Alloys

We manufacture a wide range of alloy solders and preformed alloy sheets based on non-ferrous metals such as Au, Ag, Pb, Sn, and In, offering strong customization capabilities.

Automation and Advanced Manufacturing Processes

Through continuous process optimization, our Au-Sn solder products can achieve a minimum thickness of 7 μm.

Rapid Mold Development

Equipped with a dedicated tooling department and advanced facilities, including high-precision wire-cut machining, we provide customized mold development with reduced tooling costs and fast turnaround.

Precision Stamping

We efficiently produce standard, customized, and complex-shaped solder preforms, including discs, frames, rectangles, squares, rings, and other non-standard geometries.

High Cleanliness, Mirror Finish, and Oxidation-Free

Our proprietary solder material technologies have reached an advanced international level, delivering high cleanliness and oxidation-free surfaces. These features effectively address common issues such as voiding and poor wettability.

Au-Based Solders
• Excellent corrosion resistance
• Low vapor pressure
• Superior flowability and wettability, Suitable for hermetic packaging applications, Minimum thickness: 7 μm, Minimum size: 0.2 mm × 0.2 mm

Ag-Based Solders
One of the most widely used hard solder materials, featuring excellent wettability and gap-filling capability. Suitable for brazing most ferrous and non-ferrous metals.

In-Based Solders
• Minimal erosion to gold metallization
• High reliability at extremely low temperatures
• Effectively mitigates thermal mismatch issues

Sn-Based Solders
The most used solder materials in electronic assembly, offering good wettability and excellent soldering performance.

AuSn20 Solder Preform

Applications:
The eutectic Au80Sn20 brazing alloy (melting point: 280 °C) has been widely used in the semiconductor and related industries for many years. Due to its excellent physical properties, Au-Sn alloy has become one of the most preferred brazing materials for optoelectronic device packaging.

Sigma has successfully overcome traditional technological limitations and achieved mass production of Au-Sn spherical powders, preforms, and sputtering targets. These materials help eliminate the material waste associated with screen printing and the insufficient film thickness issues found in evaporation or sputtering processes.

Au80Sn20 Solder Preform
With a eutectic temperature of 280 °C, Au80Sn20 solder preforms can be manufactured in various shapes and sizes to meet diverse application requirements.

Au-Sn eutectic solders are suitable for applications requiring high-temperature strength and excellent thermal fatigue resistance. They also offer superior wettability, high tensile strength, and strong corrosion resistance.

The melting point of Au80Sn20 is closest to that of high-lead solders. When used on gold pads or palladium–silver pads, it effectively prevents gold embrittlement and pad delamination.

Compared with low-melting-point lead-free eutectic solders, Au80Sn20 provides enhanced stability and long-term reliability.

Au80Sn20 eutectic solder does not require flux during packaging and soldering processes, avoiding contamination and corrosion risks to semiconductor chips. It is mainly used in optoelectronic packaging, high-reliability and high-power electronic device circuits, hermetic sealing, and chip packaging applications.

| Feedstock

| Paste

1. Product Description

This specification applies to the high-temperature co-fired tungsten paste manufactured by Sigma Applied Materials Co., Ltd. The product is primarily used for via-filling processes in alumina-based High-Temperature Co-Fired Ceramic (HTCC) substrates.
The product is a Pb-free and Cd-free environmentally friendly formulation and complies with RoHS requirements.

2. Product Performance Parameters

3. Recommended Processing Conditions and Methods

1. Printing Method: Stainless steel screen printing
2. Drying Conditions: 60–80 °C for 10–20 minutes
3. Sintering Conditions: Reducing atmosphere, 1500–1650 °C for 120 minutes (peak temperature)
4. Diluent: If required by the process, an appropriate amount of diluent (≤ 2%) may be added for viscosity adjustment.

4. Storage and Shelf Life

Store in a sealed container at 25 °C in a cool and shaded environment. The shelf life is 6 months.
If conditions permit, refrigerated storage below 5–10 °C is recommended. Prior to use, remove from cold storage and allow the material to roll slowly at room temperature for 6–10 hours.

5. Precautions

1. Electronic pastes are flammable materials; keep away from heat sources and open flames.
2. Do not ingest. In case of skin contact, rinse immediately with water.
3. Phase separation may occur after prolonged storage; thorough mixing will restore usability and does not affect performance.