There are four types of gold wire, being mass producing in Sigma, so far. According to the content of gold, they're: SCL(100%),SF(80%),SG(70%),SH(60%). The range of wire diameter can be produced from 0.6 to 2.0 miles. The diversified products can meet all kinds of marketing requirements, including ultra-fine application, and solve the different problems during the wire bonding operation. Of course, all of them have passed the vulcanized test and have stable uniformity of alloys' composition to maintain the mechanical properties at any time. The 4N pure gold wire has high workability and bonding arc stability and the IMC coverage is smooth with the stable growth, generally being used high-end products, such as automotive IC, controller, aerospace IC, mechanical-electronic equipment IC, etc. The gold alloy wire SF(Au 80%), with the similar bonging process window of 4N gold wire, has high workability and bonding arc stability, so it's suitable for CMOS, stacked die PKG and LED products. SG(Au70%) and SH( Au60%) are high -strength wire s and the hardness of free air ball is higher than 4N and 80% Au wire ( refer to the product data sheet ), they're suitable for low arc bonding products with good performance to anti- sulfurization.

Gold Bonding Wire

Gold Bonding Wire Data